Bio:
{Yuanwei Liu} (S'13-M'16-SM'19-F’24, \url{https://www.eee.hku.hk/~yuanwei/}) has been a (tenured) full Professor in
Department of Electrical and Electronic Engineering (EEE) at The University of Hong Kong (HKU) since September, 2024. Prior
to that, he was a Senior Lecturer (Associate Professor) (2021-2024) and a Lecturer (Assistant Professor) (2017- 2021) at
Queen Mary University of London (QMUL), London, U.K, and a Postdoctoral Research Fellow (2016-2017) at King's College
London (KCL), London, U.K. He received the Ph.D. degree from QMUL in 2016. His research interests include non-orthogonal
multiple access, reconfigurable intelligent surface, near field communications, integrated sensing and communications, and
machine learning.
Yuanwei Liu is a Fellow of the IEEE, a Fellow of AAIA, a Web of Science Highly Cited Researcher, an IEEE Communication
Society Distinguished Lecturer, an IEEE Vehicular Technology Society Distinguished Lecturer, the rapporteur of ETSI Industry
Specification Group on Reconfigurable Intelligent Surfaces on work item of “Multi-functional Reconfigurable Intelligent Surfaces
(RIS): Modelling, Optimisation, and Operation”, and the UK representative for the URSI Commission C on “Radio
communication Systems and Signal Processing”. He was listed as one of 35 Innovators Under 35 China in 2022 by MIT
Technology Review. He received IEEE ComSoc Outstanding Young Researcher Award for EMEA in 2020. He received the
2020 IEEE Signal Processing and Computing for Communications (SPCC) Technical Committee Early Achievement Award,
IEEE Communication Theory Technical Committee (CTTC) 2021 Early Achievement Award. He received IEEE ComSoc
Outstanding Nominee for Best Young Professionals Award in 2021. He is the co-recipient of the 2024 IEEE Communications
Society Heinrich Hertz Award, the Best Student Paper Award in IEEE VTC2022-Fall, the Best Paper Award in ISWCS 2022,
the 2022 IEEE SPCC-TC Best Paper Award, the 2023 IEEE ICCT Best Paper Award, and the 2023 IEEE ISAP Best Emerging
Technologies Paper Award. He serves as the Co-Editor-in-Chief of IEEE ComSoc TC Newsletter, an Area Editor of IEEE
Communications Letters, an Editor of IEEE Communications Surveys & Tutorials, IEEE Transactions on Wireless
Communications, IEEE Transactions on Vehicular Technology, IEEE Transactions on Network Science and Engineering, IEEE
Transactions on Cognitive Communications and Networking, and IEEE Transactions on Communications (2018-2023). He
serves as the (leading) Guest Editor for Proceedings of the IEEE on Next Generation Multiple Access, IEEE JSAC on Next
Generation Multiple Access, IEEE JSTSP on Intelligent Signal Processing and Learning for Next Generation Multiple Access,
and IEEE Network on Next Generation Multiple Access for 6G. He serves as the Publicity Co-Chair for IEEE VTC 2019-Fall,
the Panel Co-Chair for IEEE WCNC 2024, Symposium Co-Chair for several flagship conferences such as IEEE GLOBECOM,
ICC and VTC. He serves the academic Chair for the Next Generation Multiple Access Emerging Technology Initiative, vice
chair of SPCC and Technical Committee on Cognitive Networks (TCCN).